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 TPD1030F
Toshiba Intelligent Power Device Silicon Monolithic Power MOS Integrated Circuit
TPD1030F
2-IN-1 Low-Side Switch for Motor, Solenoid and Lamp Drive
The TPD1030F is a 2-IN-1 low-side switch. The IC has a vertical MOSFET output which can be directly driven from a CMOS or TTL logic circuit (e.g., an MPU). The IC is equipped with intelligent self-protection functions.
Features
* Two built-in power IC chips with a new structure combining a control block and a vertical power MOSFET (L2--MOS) on each chip. Can directly drive a power load from a CMOS or TTL logic. Weight: 0.08 g (typ.) Built-in protection circuits against overvoltage (active clamp), overtemperature (thermal shutdown), and overcurrent (current limiter). Low Drain-Source ON-resistance: RDS (ON) = 0.6 (max) (@VIN = 5 V, ID = 0.5 A, Tch = 25C) Low Leakage Current: IDSS = 10 A (max) (@VIN = 0 V, VDS = 30 V, Tch = 25C) Low Input Current: IIN = 300 A (max) (@VIN = 5 V, Tch = 25C) 8-pin SOP package with embossed-tape packing.
* * * * * *
Pin Assignment (top view)
Marking
SOURCE1 1
8 DRAIN1
TPD1030 F
IN1 2 7 DRAIN1
Part No. (or abbreviation code) Lot No. A line indicates lead (Pb)-free package or lead (Pb)-free finish.
SOURCE2 3
6 DRAIN2
IN2 4
5 DRAIN2
Note1: Due to its MOS structure, this product is sensitive to static electricity.
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TPD1030F
Block Diagram
SOURCE1 1 Overtemperature Detection /Protection IN1 2 Overcurrent Detection /Protection
8 DRAIN1
7 DRAIN1
SOURCE2 3 Overtemperature Detection /Protection IN2 4 Overcurrent Detection /Protection
6 DRAIN2
5 DRAIN2
Pin Description
Pin No. 1 2 3 4 Symbol SOURCE1 IN1 SOURCE2 IN2 Source pin 1 Input pin 1 This pin is connected to a pull-down resistor internally, so that even when input wiring is open-circuited, output can never be turned on inadvertently. Source pin 2 Input pin 2 This pin is connected to a pull-down resistor internally, so that even when input wiring is open-circuited, output can never be turned on inadvertently. Drain pin 2 Drain current is limited (by current limiter) if it exceeds 1 A (min) in order to protect the IC. Drain pin 1 Drain current is limited (by current limiter) if it exceeds 1 A (min) in order to protect the IC. Pin Description
5, 6
DRAIN2
7, 8
DRAIN1
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TPD1030F
Timing Chart
Input Signal
Overcurrent Protection
Overtemperature Protection
Output Current Current limiting (limiter) Overtemperature protection (Note2)
Note2: The overheating detector circuits feature hysteresis. After overheating is detected, normal operation is restored only when the channel temperature falls by the hysteresis amount (5C typ.) in relation to the overheating detection temperature.
Truth Table
IN L H L H L H VOUT H L H H H H Mode Normal
Overcurrent
Overtemperature
Absolute Maximum Ratings (Ta = 25C)
Characteristics Drain-source voltage Drain current Input voltage Power dissipation (t = 10 s) Single pulse active clamp capability (Note 4) Active clamp current Repetitive active clamp capability (Note 5) Operating temperature Channel temperature Storage temperature Symbol VDS (DC) ID VIN PD EAS IAR EAR Topr Tch Tstg Rating 40 Internally Limited -0.3 to 7 2.0 (Note 3) 10 1 0.2 -40 to 110 150 -55 to 150 Unit V A V W mJ A mJ C C C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
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TPD1030F
Thermal Characteristics
Characteristics Thermal resistance, channel to ambient (t = 10 s) (Note3) Symbol Rth (ch-a) Max 62.5 Unit C/W
Note 3: Drive operation: Mounted on glass epoxy board [25.4mm x 25.4mm x 0.8mm] (with the two devices operating) Note 4: Active clamp capability (single pulse) test condition VDD = 25 V, Starting Tch = 25C, L = 10 mH, IAR = 1 A, RG = 25 Note 5: Repetitive rating, pulse width limited by maximum channel temperature.
Electrical Characteristics
Characteristics Drain-source clamp voltage Symbol V (CL) DSS Test Circuit Test Condition Tch=-40110 Tch=25 Tch=-40110 Tch=25 Tch=-40110 Tch=25 Tch=-40110 Tch=25 Tch=-40110 Tch=25 Tch=-40110 Tch=25 Tch=-40110 Tch=25 1 tOFF Source-drain diode forward voltage VDSF Tch=-40110 Tch=25 Tch=-40110 Tch=25 IF = 1 A, VIN = 0 V VDD = 13 V, VIN = 0V/5 V, ID = 0.5 A VIN = 0 V, ID=1mA VDS = 13 V, ID=10mA VIN = 0 V, VDS=30V VIN = 5 V, at normal operation VIN = 5 V, when overcurrent protective circuit is actuated VIN = 5 V, ID = 0.5 A VIN = 5 V VIN = 5 V Min 40 1.0 0.9 3 3.5 150 1 0.7 Typ. 0.44 160 1.8 Max 60 2.8 3.0 7 7 10 100 300 A 350 0.6 0.9 30 60 60 90 1.7 V s Unit V
Input threshold voltage Protective circuit operation input voltage range Drain cut-off current
Vth
V
VIN (opr)
V
IDSS IIN (1)

A
Input current IIN (2)
Drain-source on resistance Overtemperature protection Overcurrent protection
RDS (ON) TS IS

C A
tON Switching time
Test Circuit 1
Switching time measuring circuit
Test Circuit
TPD1030F IN OUT GND To be set so that ID = 0.5 A. 13 V
Measured Waveforms
VIN Waveform 10% 90% VOUT Waveform tON 10% tOFF 13 V 90% 5V
P.G
V
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TPD1030F
Package Dimensions
Weight: 0.08 g (typ.)
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TPD1030F
RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
20070701-EN
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
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